| abstract |
A two-layer CCL, a two-layer flexible printed circuit board excellent in processability, flexibility, HAI (high current arc ignition) resistance, and moisture absorption characteristics, a resin therefor, and an insulating film comprising the same are manufactured at low cost. Use of an amide-imide resin having an amide-imide structure of the general formula (1) and other specific structures and amide structures. [Selection figure] None |