http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0715100-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62268de3e92657ca5b9adcac4778225 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 1993-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7d8843506d9442c1a452664c46ada6e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23bb575c55ea22c1872a7aa51648f26e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66e399feb3d34598f22a9b03621c0e49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e806f3910e2c7ec2968c9b02daca457 |
| publicationDate | 1995-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0715100-A |
| titleOfInvention | Ceramic substrate having metal circuit and method for manufacturing the same |
| abstract | (57) [Summary] (Modified) [Objective] To provide a ceramic substrate as a circuit substrate for a power module. [Structure] A metal circuit is joined to the upper surface and the lower surface of a ceramic substrate, and at least one of the combinations of the metal circuit portions forming the metal circuit has a thickness difference. Or a ceramic substrate having a metal circuit, in which a thickness difference is provided on the front surface and / or the back surface of at least one metal circuit portion constituting the metal circuit, and the metal. As a method that can be applied to the production of a ceramic substrate having a circuit, a bonding agent is applied to the entire upper surface and lower surface of the ceramic substrate, metal foils are superposed on each other, and after heating and bonding, a portion other than the circuit pattern of the metal foil is applied. A method for producing the same, in which a metal circuit is formed on the upper and lower surfaces of a ceramic substrate by peeling and then unnecessary adhesive is removed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014168811-A |
| priorityDate | 1993-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.