| abstract |
An Ag-Cu eutectic layer can be made thin without impairing handling properties, cracks generated in a ceramic substrate can be suppressed, and a copper metal plate and a ceramic substrate can be reliably bonded. A brazing sheet, a brazing sheet structure, and a method for manufacturing a power module substrate are provided. A brazing sheet 1 used for joining a copper metal plate 2 made of copper or a copper alloy and a ceramic substrate 3 has a brazing material layer 11 containing Ag, an active metal, and a resin. As for the content of Ag and active metal per unit area, Ag is 1 mg / cm 2 or more and 15 mg / cm 2 or less, and active metal is 0.5 mg / cm 2 or more and 6 mg / cm 2 or less. [Selection] Figure 1 |