http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0697128-A

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filingDate 1993-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf5057bfa532b4d937c4d963bdc5f62d
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publicationDate 1994-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0697128-A
titleOfInvention Method for patterning polyimide coatings during fabrication of multilayer metal structures
abstract (57) [Summary] (Modified) [Objective] It is an object of the present invention to provide a method of transferring a pattern through a polyimide underlayer during fabrication of a thin film multilayer metal structure. The method of the present invention comprises forming a fully cured thick polyimide layer 20 on a substrate 22. On top of this polyimide underlayer, a photosensitive silicon-containing polymer 2 Apply 8. Next, a resist pattern is formed by exposing through the resist layer and developing. Finally, the resist pattern is transferred into the polyimide underlayer by etching using only high density anisotropic O 2 plasma.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004200659-A
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priorityDate 1992-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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