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filingDate 1992-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abb18267de8d0ec051743e91ff5649ad
publicationDate 1994-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06188225-A
titleOfInvention Dry etching method
abstract (57) [Summary]n[Purpose] Blanket CV on TiON barrier metal B blanket W (Blk-W) laminated by the D method The layer is controlled with good control while suppressing the loading effect. Chip back to form a highly reliable plug.n[Structure] TiON barrier metal is originally Cl * Against It has high etching resistance and therefore prevents loading effects. Although it contributes to the stop, the inorganic carbon CO using nyl compounds * To pull out O atom Therefore, the above resistance is slightly reduced, and stable etch back characteristics are achieved. Get sex. For example, in the first step, S 2 F 2 / H 2 mixture The Blk-W layer 5 was etched back at high speed using gas. Then, in the second step, Cl 2 / CO 2 Ti using mixed gas Etching back the / TiON laminated barrier metal 4 The W plug 5sp can be left flat in the connection hole 3. It
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