| abstract |
(57) [Summary] [Object] To provide an epoxy resin composition for electronic devices, which gives a cured product excellent in cold-heat shock resistance, heat resistance, moisture resistance and the like when used for sealing a semiconductor element. An epoxy resin composition for electronic devices, comprising an epoxy resin and polyphenols as a curing agent and an inorganic filler, wherein the polyphenols are represented by the formula (I): An epoxy resin composition for electronic devices, which is a compound represented by: |