| abstract |
(57) [Abstract] [PROBLEMS] To provide a conductive adhesive that does not warp an adhesive when a semiconductor chip is bonded onto a lead frame via a conductive adhesive layer. In addition, a warped-free adhesive body using the conductive adhesive is provided. [Constitution] The conductive adhesive contains silver particles and spherical silica 4 having a controlled spherical diameter in the filler part, and the spherical diameter of the spherical silica 4 is made larger than that of the silver particles. In the adhesive body in which the lead frame 3 and the semiconductor chip 1 are bonded using this conductive adhesive, the spherical silica 4 in the conductive adhesive layer 2 is arranged in one layer, and the film of the conductive adhesive layer 2 is formed. The thickness is controlled to a constant value by the spherical diameter of the spherical silica 4. Therefore, by using the minimum film thickness that does not cause warpage, the amount of the conductive adhesive used can be reduced, and furthermore, the adhesive body does not warp. |