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filingDate 1991-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bcd13978f67a1571b07a270e9b9f4e40
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publicationDate 1993-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05171499-A
titleOfInvention Method and apparatus for tin or tin-lead alloy electroplating using an insoluble anode
abstract (57) [Summary] (Modified) [Constitution] Separately from the plating tank 1, a metal replenishing tank having a cathode chamber 8 / anion exchange membrane 7 / anode chamber 9 / diffusion dialysis membrane 14 / diffusion dialysis chamber 15 is installed. Then, the cathode chamber 8 and the diffusion dialysis chamber 15 are filled with a solution containing only organic sulfonic acid, the anode chamber 9 is filled with a plating solution, and the anode chamber 9 is provided with a metal tin or metal tin-lead anode. The counter electrode is installed in the plate, a voltage is applied between the electrodes to dissolve the tin or tin-lead anode, the tin or lead ion is supplied to the plating tank 1, and the organic sulfonic acid recovered in the diffusion dialysis chamber 15 is used as the cathode chamber. Supply to 8. Also plating tank 1 The metal replenishment tank 2 and the organic sulfonic acid recovery tank 2 are provided in the above box to perform metal replenishment and organic sulfonic acid recovery in separate tanks. [Effect] Replenishing the lacking metal (tin or lead) with plating tank 1 Can be easily performed without affecting the composition.
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