http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013237894-A

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publicationDate 2013-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013237894-A
titleOfInvention Plating apparatus and plating solution management method
abstract The plating solution can be used for a longer time by performing the plating treatment while adjusting the free acid concentration of the plating solution within a preferable range. A plating bath 10 in which an insoluble anode 12 and a substrate W are immersed in a plating solution held inside the plating bath 10 and a plating solution in which the plating solution in the plating bath 10 is drawn out and returned to the plating bath 10 for circulation. A dialysis line 48, a dialysis tank 42 installed in the plating solution dialysis line 48 to remove free acid from the plating solution by dialysis using the anion exchange membrane 40, and a free solution in the plating solution connected to the plating tank 10. A free acid concentration analyzer 62 that measures the acid concentration, and a controller 70 that controls the amount of the plating solution flowing along the plating solution dialysis line 48 based on the free acid concentration analysis value of the free acid concentration analyzer 62; Have [Selection] Figure 1
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