| abstract |
(57) [Abstract] The present invention is a system for removing a wafer material such as a wafer having silicon on an insulator on a substrate to a predetermined thickness to obtain a wafer having a predetermined thickness profile. The purpose is to remove material from. [Structure] Means 12 for determining thickness profile data for a wafer 14, means 16 for generating a stay time vs. position map 18 generated from this thickness profile data for a wafer 14, and stay time vs. position map 18 Means 22 for removing material from the wafer 14 controlled in accordance with. |