http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04278587-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0a6a69da5879eb83f56f6876dba3e3cf
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-792
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
filingDate 1991-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5c27be02d1133fdded0001692c8e504
publicationDate 1992-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04278587-A
titleOfInvention Manufacture of semiconductor memory
abstract PURPOSE: To provide a manufacturing method for a floating gate type semiconductor memory in which a program voltage can be lowered without deteriorating memory characteristic and deterioration upon rewriting can be reduced. n CONSTITUTION: A step of forming an insulating film 10 containing at least a silicon nitride film on one conductivity type semiconductor substrate 1, a step of hydrogen plasma processing, a step of forming a floating gate electrode 11 on the film 10, and a step of forming a control gate electrode 13 on the film 11 through an insulating film 12, are provided. Since hydrogen content of the nitride film for constituting the film 10 is increased by the hydrogen plasma processing, electric conductivity is reduced, and even if the silicon nitride film is used as a tunneling insulating film, memory characteristic is not deteriorated. n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6335549-B1
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priorityDate 1991-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 21.