http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04239018-A

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filingDate 1991-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28d76e965a8f6f26315e982e6beffc8b
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publicationDate 1992-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04239018-A
titleOfInvention New curable polyphenylene ether/epoxy resin composition, and composite material and laminate prepared therefrom
abstract PURPOSE: To provide a new curable polyphenylene ether/epoxy resin composition which has the excellent dielectric properties of polyphenylene ether and the well-balanced properties and economical profitability of epoxy resin and can develop excellent heat resistance and flame retardancy when cured. n CONSTITUTION: A reaction product (a) of a polyphenylene ether resin with an unsaturated carboxylic acid or anhydride is mixed with triallyl isocyanurate and/or triallyl cyanurate (b) and a resin composition (c) essentially consisting of brominated bisphenol polyglycidyl ether epoxy resin, a novolac epoxy resin and a phenolic resin and optionally an initiator and a cure accelerator. The obtained mixture is formed into a film or infiltrated into a base to obtain a composite material. The film or composite material is optionally laminated with a metallic foil or sheet, and then heated and cured. The mixing ratio between components (a) and (b) is such that 98-40 pts.wt. component (a) is used per 2-60 pts.wt component (b) and component (c) is used in an amount of 10-90 pts.wt. per 90-10 pts.wt. total of components (a) and (b). n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4622369-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014101431-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005060688-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017179035-A
priorityDate 1991-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 36.