http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017179035-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
filingDate | 2016-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb657297dabb166058c72cb59b2a021a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dd6752ea9203272be18c8f9ea5f6b29 |
publicationDate | 2017-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2017179035-A |
titleOfInvention | Resin composition, prepreg, metal-clad laminate, printed wiring board, and metal foil with resin |
abstract | The present invention provides a resin composition capable of realizing a high glass transition temperature, reducing the dielectric constant, and increasing the peel strength. A resin composition includes (A) an epoxy resin, (B) a reaction product of a bifunctional polyphenylene ether compound and a monofunctional acid anhydride, and a pre-reaction product capable of reacting with an epoxy group, C) a curing agent for epoxy resin. When the total mass of the component (A), the component (B), and the component (C) is 100 parts by mass, the content of the component (B) is 5 to 60 parts by mass. [Selection] Figure 1 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020523450-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020100699-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022210227-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021157249-A1 |
priorityDate | 2016-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.