http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04209648-A

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filingDate 1990-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1992-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04209648-A
titleOfInvention Epoxy resin composition for sealing photosemiconductor
abstract PURPOSE: To prepare the title compsn. excellent in transparency, crack resistance, etc., and hardly undergoing degradation in luminance by mixing a bisphenol epoxy resin, an alicyclic epoxy resin, an epoxidized 1,2-polybutadiene, and a phthalic anhydride. n CONSTITUTION: A bisphenol epoxy resin (e.g. a bisphenol A epoxy resin), an alicyclic epoxy resin [e.g. Celloxide 2021 (a trade name)], an epoxidized 1,2- polybutadiene (e.g. a compd. of the formula wherein (n) is about 5), and a phthalic anhydride (e.g. hexahydrophthalic anhydride) are mixed as essential components to give the title compsn. A curing accelerator, a reductive discoloration preventive, etc., may further be added to the compsn. The epoxidized 1,2- polybutadiene mixed with the bisphenol epoxy resin as above lowers the stress in the compsn. n COPYRIGHT: (C)1992,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016117802-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002226551-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013213220-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011137092-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07304854-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5478885-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017018279-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006188622-A
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Total number of triples: 39.