http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006225464-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2005-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7cc1048f6c2ad9ec0be2ecca9d3c885 |
| publicationDate | 2006-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006225464-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition suitable for area mounting type semiconductor encapsulation and having a small warpage and excellent solder crack resistance, and a semiconductor device using the same. SOLUTION: (A) A phenol aralkyl type epoxy resin having a biphenylene skeleton, (B) a biphenol type or bisphenol type crystalline epoxy resin, (C) a phenol aralkyl resin having a biphenylene skeleton, (D) a curing accelerator, E) The inorganic filler and (F) the epoxidized polybutadiene compound are the main components, and the weight ratio [(A) / (B)] of the component (A) to the component (B) is 10/90 to 90/10. And (E) component is contained in the total epoxy resin composition in a proportion of 80% by weight or more and 94% by weight or less, and (F) the epoxidized polybutadiene compound is contained in the total epoxy resin composition by 0.05% by weight or more. An area-mounting type epoxy resin composition for encapsulating a semiconductor, characterized by comprising 5% by weight or less. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016183258-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010202758-A |
| priorityDate | 2005-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.