http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02230249-A

Outgoing Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
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filingDate 1989-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1280ce817e240bf128d0402e31feeff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63b5e874e8422babd1e8759c50625d07
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publicationDate 1990-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H02230249-A
titleOfInvention Positive photoresist
abstract PURPOSE: To form an image withstanding reactive ion etching with oxygen plasma and having high resolution by using a positive photoresist contg. an organosilicon compd. having quinonediazo groups as terminal groups and a phenolic novolak polymer in a specified ratio. n CONSTITUTION: This photoresist contains an organosilicon compd. having quinonediazo groups as terminal groups and a phenolic novolak polymer. The amt. of the organosilicon compd. is about 5-50wt.%, preferably about 10-30wt.% of the total amt. of the organosilicon compd. and the phenolic novolak polymer. An image withstanding dry processing, especially reactive ion etching in oxygen plasma and having high resolution can be formed. n COPYRIGHT: (C)1990,JPO
priorityDate 1988-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 27.