http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01238930-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 1988-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf1dbc078a47cca993b0dfa870a2044f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac1aa680ddd1d344ab3b7c3b8f64f5ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_621de7aabbb2295c0e8d885ac218cee5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26a03ea266b98cdbe61d1ba0dd4f6bae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09769f4b87a99e79eb2a42ec9ec682a5 |
| publicationDate | 1989-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H01238930-A |
| titleOfInvention | Metal plate base copper-laminated plate |
| abstract | PURPOSE: To improve solder heat resistance, thermal pressure resistance, bending workability and adhesive properties of an insulating layer by composing the insulating layer of a first insulating layer formed of heat resistant resin at the side of a copper foil, and a second insulating layer formed of thermosetting resin at the side of a metal plate. n CONSTITUTION: In a laminated plate in which a copper foil 1 is adhered through an insulating layer to a metal plate 4, the insulating layer is composed of a first insulating layer 2 at the side of the foil 1, and a second insulating layer at the side of the plate 4. The layer 2 is formed of heat resistant resin having 200°C or higher of glass transition point and a normal chain structure such as polyimide, polyamideimide, etc., its thickness is preferably 10μm to 40μm, thereby obtaining heat pressure resistant effect. The second layer 3 is formed of thermosetting resin modified with maleimide resin. As the maleimide, epoxy resin, phenol resin, etc., are employed, and they are modified to provide excellent performance in the adhesive properties, solder heat resistance with the layer 2 without loss of bending workability. n COPYRIGHT: (C)1989,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4616682-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023058667-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018086738-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006281458-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020523435-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04144741-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11459449-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0415733-U |
| priorityDate | 1988-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.