http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6099778-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2016-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6099778-B1 |
| titleOfInvention | A copper foil with a carrier, a laminate, a printed wiring board, a printed wiring board manufacturing method, and an electronic device manufacturing method. |
| abstract | Provided is a copper foil with a carrier capable of satisfactorily peeling an ultrathin copper layer from a carrier in a laminate produced by laminating a copper foil with a carrier on a resin substrate. A copper foil with a carrier having a carrier, an intermediate layer, and an ultrathin copper layer in this order, and the surface of the carrier opposite to the ultrathin copper layer is measured with a laser microscope in accordance with JIS B0601-1994. A copper foil with a carrier having a surface ten-point average roughness Rz of 6.0 μm or less. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017108141-A |
| priorityDate | 2015-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 154.