http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015010275-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 |
| filingDate | 2013-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a590ab99d1c027a6941aa93eae69fa4e |
| publicationDate | 2015-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015010275-A |
| titleOfInvention | Copper foil with carrier, manufacturing method thereof, printed wiring board, printed circuit board, copper-clad laminate, and manufacturing method of printed wiring board |
| abstract | The adhesion between the carrier and the ultrathin copper layer is high before the laminating process, but after the laminating process, it can be easily peeled off at the carrier / ultrathin copper layer interface, and pinholes on the surface of the ultrathin copper layer can be easily removed. Provided is a copper foil with a carrier in which generation is satisfactorily suppressed. A copper foil with a carrier comprising a carrier, an intermediate layer, and an ultrathin copper layer, the intermediate layer being made of a tungsten-nickel alloy, a tungsten-cobalt alloy, or a tungsten-iron alloy. If the intermediate layer contains 50 to 10000 μg / dm 2 of tungsten, the intermediate layer contains nickel, the deposited amount of nickel is 50 to 40000 μg / dm 2 , and if the intermediate layer contains cobalt, the deposited amount of cobalt Is 50 to 10000 μg / dm 2 , and when the intermediate layer contains iron, the iron adhesion amount is 50 to 10,000 μg / dm 2 , and the maximum copper concentration is 1 to 70% by mass. [Selection] Figure 5 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016135917-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101852671-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017007327-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017007326-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6023367-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017106092-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015122258-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6099778-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017108141-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6023366-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160090255-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10178775-B2 |
| priorityDate | 2013-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 243.