http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4763236-B2
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32137 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32137 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46 |
filingDate | 2002-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-4763236-B2 |
titleOfInvention | Method for etching a pattern in an etching body using plasma |
abstract | The invention relates to a method for etching structures in an etching body (19), especially recesses in a silicon body which are laterally and precisely defined by an etching mask, by means of a plasma (15). According to said method, a high-frequency pulsed, low-frequency modulated high frequency power is injected into the etching body (19), at least temporarily, by means of a high-frequency alternating voltage, and the intensity of the plasma (15) is modulated as a function of time. |
priorityDate | 2001-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 |
Total number of triples: 19.