http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4763236-B2

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32137
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
filingDate 2002-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-4763236-B2
titleOfInvention Method for etching a pattern in an etching body using plasma
abstract The invention relates to a method for etching structures in an etching body (19), especially recesses in a silicon body which are laterally and precisely defined by an etching mask, by means of a plasma (15). According to said method, a high-frequency pulsed, low-frequency modulated high frequency power is injected into the etching body (19), at least temporarily, by means of a high-frequency alternating voltage, and the intensity of the plasma (15) is modulated as a function of time.
priorityDate 2001-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

Total number of triples: 19.