http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3982336-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 2002-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3982336-B2 |
| titleOfInvention | Semiconductor wafer processing method and plasma etching apparatus |
| priorityDate | 2002-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.