| abstract |
A method of fabricating shaped blocks comprising an integrated circuit device, comprising the steps of: providing a substrate (10) having a top surface (15) and a backside; growing a sacrificial layer (13) overlying said top surface; forming a block layer overlying said top surface; and masking and etching said block layer up to said sacrificial layer forming a plurality of shaped blocks (19) on and in contact with said sacrificial layer. <IMAGE> |