http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022085795-A

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filingDate 2020-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fd0bf8a8a80a630fa0956375a59c048
publicationDate 2022-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2022085795-A
titleOfInvention Board processing method and board processing equipment
abstract PROBLEM TO BE SOLVED: To effectively remove a thin film (for example, a hard mask) formed on a substrate, minimize the residual process by-product in the processing space in the chamber, and obtain the process by-product remaining in the processing space in the chamber. Provided are a substrate processing method and a substrate processing apparatus capable of effectively discharging. The present invention provides a method for processing a substrate. In the method of treating a substrate, water and a treatment fluid containing alcohol are supplied to the treatment space of the chamber, plasma is generated from the treatment fluid, and a thin film containing boron formed on the substrate is removed. can do. [Selection diagram] FIG. 5
priorityDate 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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