| abstract |
A slurry for polishing a surface or substrate containing at least partially ruthenium and copper, the slurry containing an alkali hydroxide, an oxygen-containing halogen compound, and a halogen alkylbenzotriazole. The slurry may further contain an abrasive, an acid and optionally an alkoxylated alcohol. With these components, the slurry exhibits a high ruthenium to copper polishing rate ratio. [Selection diagram] Fig. 1 |