| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2fb272959740a2231f287ac6bf4d190a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4587
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32834 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 |
| filingDate |
2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28e1225d67bd8a43835d0379ea6ffd0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a082f31529d309d680ed29c706948e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc22150bec6085a695e9de04ef618aa1 |
| publicationDate |
2021-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2021101479-A |
| titleOfInvention |
Plasma generator, substrate processing equipment, reaction tube, plasma generation method, semiconductor device manufacturing method and program |
| abstract |
PROBLEM TO BE SOLVED: To provide a technique capable of uniformly processing a substrate. SOLUTION: A gas supply unit for supplying gas, a first rod-shaped electrode and a second rod-shaped electrode connected to a high-frequency power source, and a grounding are provided between the first rod-shaped electrode and the second rod-shaped electrode. With one rod-shaped electrode to be plasma-generated in a plasma generation region between the first rod-shaped electrode and one rod-shaped electrode, and a first gas supply port for supplying the plasmaized gas to the processing chamber. A buffer structure having a second gas supply port for plasmaizing gas in a plasma generation region between a second rod-shaped electrode and one rod-shaped electrode and supplying the plasmaized gas to the processing chamber. A plasma generator equipped with, and a technique using the same are provided. [Selection diagram] Fig. 2 |
| priorityDate |
2016-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |