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filingDate 2019-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2021-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2021044351-A
titleOfInvention Film formation method, film formation equipment and film formation system
abstract PROBLEM TO BE SOLVED: To take over the shape of a pattern and form a film on the upper part of the pattern. A film forming method includes a first film forming step, a second film forming step, a first etching step, and a second etching step. In the first film forming step, a first film is formed on the substrate on which the pattern is formed so that a thick film is formed on the upper part of the pattern. In the second film forming step, a second film is formed on the upper surface of the first film. In the first etching step, etching is performed in which the selection ratio of the first film is higher than that of the second film. The second etching step etches the second film. [Selection diagram] Fig. 2
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