| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-20235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-24564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-2007 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02N13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23Q3-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02N13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2019-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58344c0174d522c25b7b08f2cdd245b0 |
| publicationDate |
2021-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2021012985-A |
| titleOfInvention |
Processing methods, mounts, plasma processing equipment, and programs |
| abstract |
PROBLEM TO BE SOLVED: To reduce a residual adsorption force of an electrostatic chuck. A treatment method includes a measurement step, a calculation step, and a first plasma treatment step. In the measurement step, the load value applied to the lift pin when the processed substrate is lifted by the lift pin from the electrostatic chuck holding the substrate is measured. In the calculation process, the amount of change in the load value is based on the measured load value and the initial load value applied to the lift pin when the substrate is lifted by the lift pin when there is no residual adsorption force between the electrostatic chuck and the substrate. It is calculated. In the first plasma processing step, when the amount of change in the load value is equal to or greater than a predetermined first threshold value, the surface of the electrostatic chuck is exposed to the first plasma. [Selection diagram] Fig. 4 |
| priorityDate |
2019-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |