| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3299
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G05D23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2020-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c777a895b856bc51b7e0afbff96ef0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d1e55f4a702be4218fe316de022e739
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f104e7377ccb97e505c7ba867b8e85d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4b4a5429c2afa4d3c52e380f407bf54 |
| publicationDate |
2021-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2021005716-A |
| titleOfInvention |
Advanced temperature control for wafer carriers in plasma processing chamber |
| abstract |
PROBLEM TO BE SOLVED: To provide a temperature control system and method for a wafer carrier which performs accurate temperature control. SOLUTION: In a wafer carrier in a plasma processing chamber, a heat exchanger 450 supplies a temperature-controlled thermal fluid to a fluid channel of a workpiece carrier 404 and receives the thermal fluid from the fluid channel. In wFib440, a proportional valve exists between the heat exchanger and the fluid channel to control the flow rate of the thermal fluid from the heat exchanger to the fluid channel. A gas pressure valve also exists between the heat exchanger and the fluid channel to further control the flow rate of the thermal fluid from the heat exchanger to the fluid channel. The temperature controller 430 receives the measured temperature from the thermal sensor of the carrier, controls the proportional valve and the gas pressure valve in response to the measured temperature, and adjusts the flow rate of the thermal fluid. [Selection diagram] Fig. 4 |
| priorityDate |
2016-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |