| abstract |
PROBLEM TO BE SOLVED: To provide a polishing liquid composition capable of improving polishing selectivity while ensuring a polishing rate of a silicon oxide film in one embodiment. SOLUTION: In one aspect, the present disclosure contains cerium oxide particles (component A), a water-soluble polymer (component B), an anionic condensate (component C), and an aqueous medium, and the component B is contained. Refers to a polishing liquid composition for a silicon oxide film, which is a polymer containing a structural unit b1 represented by the following formula (I). [Selection diagram] None |