| abstract |
During the pretreatment process, hydrogen plasma is used to remove contaminants (eg, oxygen, carbon) from the surface of the wafer. Hydrogen plasma can be injected into the plasma chamber via an elongated injection nozzle. With such an elongated injection nozzle, a flow of hydrogen plasma with significant radial velocity flows over the wafer surface and carries volatile compounds and other contaminants from the wafer surface to the exhaust manifold. Placing a protective liner made of crystalline silicon or polysilicon on the inner surface of the plasma chamber can prevent contaminants from being released from the surface of the plasma chamber. To further reduce the sources of pollutants, silicon exhaust restrictors are used to prevent hydrogen plasma from flowing into the exhaust manifold and volatile compounds and other contaminants flow back from the exhaust manifold into the plasma chamber. You can prevent it from happening. |