http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020529922-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11334 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-117 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13101 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-742 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 |
| filingDate | 2018-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020529922-A |
| titleOfInvention | Hot wall flux-free solder ball processing equipment |
| abstract | A processing chamber (10) oriented vertically to process a wafer chip (34) with flux-free solder balls (or plated solder balls). The processing chamber (10) includes a first or upper heater (18/24) at the upper end of the processing chamber and a second or lower heater (70) at the lower end of the processing chamber. The processing chamber is a centrally located, flux-free solder ball that can move up and down within the processing chamber in response to temperature sensing monitoring of the wafer chip (34) supported by the wafer chip support ring (30). Includes a support ring (30) pre-mounted with mounting wafer chips. [Selection diagram] Fig. 1 |
| priorityDate | 2017-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.