http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020521036-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14 |
| filingDate | 2017-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020521036-A |
| titleOfInvention | Method for producing polyamic acid resin having ease of laser peeling and high heat resistance, and polyimide resin film produced using the same |
| abstract | PROBLEM TO BE SOLVED: To provide a method for producing a polyamic acid resin having laser peelability and high heat resistance, and a polyimide resin film produced by using the polyamide resin produced thereby. SOLUTION Since laser peeling can be performed with low energy while maintaining an appropriate adhesive force with glass or the like, peeling can be performed without damage (curl, defect, breakage, etc.) of a thin film, and high heat resistance is provided. The polyamic acid resin is manufactured, and the polyimide resin film manufactured by using the polyamic acid resin can be effectively used for flexible display substrate materials, semiconductor materials, and the like. [Selection diagram] |
| priorityDate | 2017-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.