http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020174115-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6dd74b20fbf2e0ebf10c7bfad4f6c8c5 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 |
| filingDate | 2019-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21ceb2acfdb29885c23b60fdd572baa4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e65bf0b3a75670bdeffc250d8c636421 |
| publicationDate | 2020-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020174115-A |
| titleOfInvention | Multilayer circuit board |
| abstract | PROBLEM TO BE SOLVED: To provide a multilayer circuit board capable of improving the productivity of a substrate including a high frequency circuit. A multilayer circuit board (30) in which a first circuit board (10) including a high-frequency board and a second circuit board (20) bonded to the first circuit board (10) are overlapped and joined in their respective thickness directions. A connection portion between the first circuit board 10 and the second circuit board 20 that electrically connects the first circuit board 10 and the second circuit board 20 via a solder layer or a conductive paste layer. It has 31 and a heat conductor 33 that conducts heat from the second circuit board 20 to the first circuit board 10. [Selection diagram] Fig. 1 |
| priorityDate | 2019-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.