abstract |
A resin composition having excellent dielectric properties and excellent workability, and a low dielectric constant resin sheet, a prepreg, a metal foil-clad laminate, a high-frequency circuit board, and a resin composition using the resin composition A multilayer wiring board is provided. A resin composition containing an epoxy resin, a curing agent, and a fluororesin filler. Content of a fluororesin filler is 50-85 mass% with respect to solid content of a resin composition. [Selection figure] None |