http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020161839-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-022 |
| filingDate | 2020-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12bc5b00c78815f2dd10b721001423d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c542f37dd7b0d7bfe0c7fdac3e68833b |
| publicationDate | 2020-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020161839-A |
| titleOfInvention | Bump root reinforcement sheet |
| abstract | PROBLEM TO BE SOLVED: To provide a bump root reinforcing sheet capable of reinforcing a root portion on a primary mounting board side even with a solder bump having a large diameter and achieving good electrical connection with a secondary mounting board. .. SOLUTION: A base material sheet and a thermosetting resin sheet laminated on the base material sheet are provided. A bump root reinforcing sheet in which the thickness t [μm] of the base material sheet and the minimum melt viscosity η [Pa · s] of the thermosetting resin sheet at 50 to 180 ° C. satisfy the following relational expression. 150 ≦ t ・ η ≦ 100000 [Selection diagram] Fig. 2A |
| priorityDate | 2020-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 142.