http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020155461-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3b0a3dbf8d6c9712d86ea1383fd5327 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2019-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e121c040ae776a02011874b2641b1f9b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5734faa253f645fac8eeb508f6ce777d |
| publicationDate | 2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020155461-A |
| titleOfInvention | A joining sheet and a method of joining electronic components to a substrate using this joining sheet |
| abstract | PROBLEM TO BE SOLVED: To provide a bonding sheet having high bonding strength when an electronic component is bonded to a substrate, and a method of bonding an electronic component to a substrate using the bonding sheet. SOLUTION: This is a bonding sheet in which Ag fine particles having an average particle size of 10 nm to 500 nm are coated and fixed on both sides of a core sheet made of Cu foil at an average coverage rate of 70% or more. The surface roughness Ra of the Cu foil is preferably 1.0 μm or less, and the average crystallite diameter of Cu constituting the Cu foil is preferably 10 μm or less. [Selection diagram] Fig. 1 |
| priorityDate | 2019-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.