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filingDate 2020-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a040a6c042a888d95c95dd46428fc932
publicationDate 2020-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020074423-A
titleOfInvention Electrostatic chuck assembly for high temperature processing
abstract PROBLEM TO BE SOLVED: To provide an electrostatic chuck usable for high temperature processing. In a semiconductor processing chamber, an electrostatic chuck assembly includes a pack and a cooling plate. The puck 166 includes an electrically insulative upper pack plate that includes one or more heating elements 176 and one or more electrodes 180 for electrostatically fixing the substrate 144 and is bonded to the upper pack plate by a metal bond. The lower pack plate further includes a plurality of structures distributed on the bottom surface of the lower pack plate at different distances from the center of the lower pack plate. Each of the plurality of structures houses one of the plurality of fasteners. The cooling plate is coupled to the pack by a plurality of fasteners, each fastener applying substantially equal fastening force to couple the cooling plate 164 to the pack 166. [Selection diagram] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112021002380-T5
priorityDate 2014-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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