| abstract |
A resin composition that provides a cured product having excellent moldability, a low elastic modulus even at high temperatures, a low glass transition temperature, and excellent reflow resistance and heat resistance, and a semiconductor device sealed with the cured product Offer. [Solution] A thermosetting resin composition for semiconductor encapsulation comprising the following components (A), (B), (C) and (D). (A) Epoxy resin solid at 25 ° C. (B) Organopolysiloxane having at least one cyclic imide group and at least one siloxane bond in one molecule (C) Inorganic filler (D) Anionic curing accelerator [Selection diagram] None |