| abstract |
[PROBLEMS] To improve solder resistance between electrodes and mechanical resistance when a load is applied to an electronic device when the electrodes included in the electrode member are soldered together and the electrode member is filled with a resin composition. And obtaining an electronic device that can improve the connection reliability of the electronic device and can cope with high-speed signal transmission. A resin composition of the present invention is a film-like resin composition that is interposed between electrodes facing each other and electrically connects the electrodes facing each other, wherein the resin composition comprises (A ) Containing an epoxy resin, (B) a film-forming resin, and (C) a filler, having a melt viscosity V1 at 100 ° C. of 200 Pa · s to 30000 Pa · s, The elastic-plastic ratio of the resin composition is 10% or more and 50% or less. [Selection] Figure 1 |