| abstract |
An object of the present invention is to facilitate extraction of noise transmitted to a support substrate. A trench isolation part (20) is formed on a semiconductor substrate (10) on which a support substrate (11), a buried insulating film (12), and an active layer (13) are sequentially laminated to partition the active layer (13) into a plurality of regions including a drawing region (32). In addition, a contact electrode 81 that is electrically connected to the support substrate 11 is formed in the extraction region 32. The contact electrode 81 has a width along the surface direction of the semiconductor substrate 10 such that a minimum width L1 of a portion in contact with the support substrate 11 is wider than a minimum width L2 of a portion located in the active layer 13. . [Selection diagram] Fig. 1 |