| abstract |
An article including a glass-based substrate with holes, a semiconductor package including the article with holes, and a method of making holes in a substrate are disclosed. In one embodiment, the article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. It said at least one hole has an interior wall having the surface roughness R a 1 [mu] m. The at least one hole has a first opening having a first diameter present in the first surface. The first plane is defined by the first surface of the glass-based substrate based on the average thickness of the glass-based substrate. The ratio of the depression depth to the first diameter of the at least one hole is 0.007 or less. |