http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019525972-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2017-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019525972-A |
| titleOfInvention | Polishing composition comprising an amine-containing surfactant |
| abstract | The present invention is a chemical mechanical polishing composition, comprising: (a) a wet process ceria abrasive; and (b) a surfactant comprising an amine-containing anchor group and an ethylene oxide-propylene oxide stabilizing group, comprising: A polishing composition having a molecular weight of 1000 Daltons to about 5000 Daltons, (c) an aromatic or heteroaromatic carboxylic acid, and (d) water, wherein the polishing composition is from about 3 to about 6 A polishing composition having a pH of is provided. The present invention further provides a method of chemically mechanically polishing a substrate using the chemical mechanical polishing composition of the present invention. Typically, the substrate contains silicon oxide. [Selection] Figure 1 |
| priorityDate | 2016-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.