| abstract |
The present invention relates to a ceria abrasive, one or more nonionic polymers, an optional one or more phosphonic acids, an optional one or more nitrogen-containing zwitterionic compounds Optional sulfonic acid copolymer, optional anionic copolymer, optional one or more polymers, including quaternary amines, adjusting the pH of the polishing composition; A chemical mechanical polishing composition is provided that includes one or more optional compounds, water, and optional additives. The present invention further provides a method of chemical mechanical polishing a substrate with the chemical mechanical polishing composition of the present invention. Typically, the substrate includes silicon oxide, silicon nitride and / or polysilicon. |