| abstract |
Described herein is a method for depositing a plasma resistant ceramic coating on the surface of a chamber component using a non-line-of-sight (NLOS) deposition process such as atomic layer deposition (ALD) and chemical vapor deposition (CVD). The plasma resistant ceramic coating consists of erbium-containing oxide, erbium-containing oxyfluoride, or erbium-containing fluoride. A chamber component having a plasma resistant ceramic coating of erbium-containing oxide, erbium-containing oxyfluoride or erbium-containing fluoride is also described. |