http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019519929-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76856 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76858 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76864 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76871 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate | 2017-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019519929-A |
| titleOfInvention | Method of forming a Cu interconnect, device structure, and Cu interconnect |
| abstract | The present invention provides a technique for improving the reliability in a Cu interconnect using a Cu intermetallic compound. In one aspect, a method of forming a Cu interconnect in a dielectric over a Cu line comprises: forming at least one via in the dielectric over a Cu line; Depositing a metal layer on the dielectric and lining the vias so as to contact the Cu line at at least one metal capable of reacting with Cu to form a Cu intermetallic compound And annealing the metal layer and the Cu line under conditions sufficient to form a Cu intermetallic barrier at the bottom of the via, and Cu in the via to form a Cu interconnect. Plating the Cu interconnects separated from the Cu lines by a Cu intermetallic barrier. Also, a device structure is provided. [Selected figure] Figure 1 |
| priorityDate | 2016-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 102.