| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-1215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2170-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2475-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B43-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 |
| filingDate |
2017-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019509370-A |
| titleOfInvention |
Electrical peeling of PU hot melt adhesive by using conductive ink |
| abstract |
Electrical Peeling of PU Hot Melt Adhesives by Use of Conductive Inks. The present invention relates to a method of reversibly bonding a first substrate and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising the following: electrically non-conductive Coating the surface of the conductive substrate with a conductive ink; an electrically releasable hot melt adhesive composition on the surface of the first substrate and / or the second substrate coated with the conductive ink. Applying; contacting a first substrate and a second substrate such that an electrically releasable hot melt adhesive composition is interposed between the two substrates; adhering between the two substrates Forming a bond to provide a bonded substrate; and optionally, between the electrically strippable hot melt adhesive composition and the substrate surface by applying a voltage to the bonded substrate. Substantially weak adhesion at at least one interface Including the Rukoto. Furthermore, the invention relates to the bonded substrate thus obtained. |
| priorityDate |
2016-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |