| abstract |
10,000～250,000G / mol molecular weight (M W) at least one polyamide 20% to 90% by weight having, at least one organic or inorganic salt 1-25 wt%; melt containing additives 0-60% by weight additional adhesive A melt adhesive, wherein the adhesive has a softening point of 100 ° C to 220 ° C. Furthermore, a reversible adhesive bonding method of substrates is described, wherein the adhesive bonding is released under tension after application of voltage. |