| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf334efdc57a817d413aef1d9f5e9d80 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B26F3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-364 |
| filingDate |
2018-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b49e678cf3556858aa4d6ff43a71f14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec5e66859b1ac626e40c23f6c1e46558 |
| publicationDate |
2019-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019192718-A |
| titleOfInvention |
Wafer processing method |
| abstract |
Provided is a wafer processing method in which even if a wafer is divided into individual devices by applying an external force by positioning a pressing blade on a planned division line, the quality of the device is not deteriorated. SOLUTION: A step of positioning a wafer in an opening of a frame F having an opening for accommodating a wafer 10 and laying a polyester sheet 30 on the rear surface of the wafer and the outer periphery of the frame; heating and thermocompression bonding the polyester sheet; A step of integrating the frame and the frame with a polyester sheet, a step of irradiating the condensing point of the laser beam on the first scheduled dividing line and the second scheduled dividing line, and forming a dividing starting point; Positioning the pressing blade on the planned dividing line and applying external force to divide the first scheduled dividing line; and positioning the pressing blade on the second scheduled dividing line and applying external force to divide the second scheduled dividing line And at least a process. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11476161-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11587832-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11610815-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021129260-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11380587-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11024543-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11049772-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11049757-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11251082-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11302578-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11393721-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10998232-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11361997-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11594454-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11004744-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11322407-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11380588-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11712747-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11289379-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10985067-B2 |
| priorityDate |
2018-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |