http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014170845-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_feb5c46e949ffc8c3c8a53b81339ab0a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837f51ca2d7606e381069127d94ef66d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d |
| publicationDate | 2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014170845-A |
| titleOfInvention | Manufacturing method of semiconductor device, sheet-shaped resin composition, and dicing tape-integrated sheet-shaped resin composition |
| abstract | PROBLEM TO BE SOLVED: To dissolve a sheet-like resin composition attached to the other surface of a wafer with a support when the support is peeled from a wafer with a support bonded to the wafer and the support through a temporary fixing layer. To provide a method for manufacturing a semiconductor device capable of suppressing the occurrence. SOLUTION: A step of preparing a wafer with a support in which a support is bonded to one surface of a wafer on which a through electrode is formed via a temporary fixing layer; and the other surface of the wafer on a dicing tape Step B for preparing a dicing tape-integrated sheet-shaped resin composition in which a sheet-shaped resin composition having a small outer shape is formed; A method for manufacturing a semiconductor device, comprising: a step C for bonding to the resin-like resin composition; and a step D for dissolving the temporary fixing layer with a solvent and peeling the support from the wafer. [Selection] Figure 3 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7037422-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019186491-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020009896-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020009895-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020009897-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019192718-A |
| priorityDate | 2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 213.