| abstract |
The present invention is suitable for polishing a polishing object having a layer containing a high mobility material having a higher carrier mobility than Si, and suppresses excessive dissolution of the layer containing a high mobility material and is efficient. A polishing composition capable of polishing is provided. A polishing composition for use in polishing an object to be polished having a layer containing a high mobility material having a higher carrier mobility than Si, comprising abrasive grains and a monovalent acid. At least one salt compound selected from the group consisting of a salt, a divalent acid salt, a trivalent acid salt, and a halide salt, having an electrical conductivity of 1 mS / cm or more, It is polishing composition whose content of hydrogen oxide is less than 0.1 mass%. [Selection figure] None |